WAND Depaneling

The WAND Depaneling System, a Larsen Manufacturing Business Unit, designs and builds today’s most elite depaneling equipment for the Printed Circuit Board (PCB) industry. By greatly reducing and eliminating any stress or flex during the separation process of multiple populated Printed Circuit Boards (PCB’s), the WAND Depaneling System safeguards against fractured joints, excess burrs, and leaves disjointed arrays quickly and cleanly separated. The WAND System is perfectly suited to accommodate medium to high volume PCB separation needs.

Tooling Change

Inherent in the design of the press, product changeover is complete in under 3 minutes.


  • Air/Oil Power Pack
  • Quick Change Clamping
  • Die Package
    Storage Elevator (Optional)
  • Air Logic Control
  • 12 second cycle time
  • Fully Enclosed Structure
  • 1 1/2” Maximum Component
    Height including board thickness
The Singulation Process 3016AT / 5016AT
The standard WAND Depaneling Singulation press is capable of punching individual or multiple populated panels within any specified working area. The operation is semi-automatic. Once the operator places the populated array into the “Depaneler”, a shuttle transports the tool into the enclosed cutting area for the separation. The bottom tool returns to the operator, with the PCB board quickly and cleanly separated, and the cycle is complete. Total cycle time = 12.0


The standard Singulation tool is capable of punching individual or multiple populated panels. Tooling weight less than 125 lbs.


  • Optical Touch Controls
  • Completely Guarded Cutting area
  • Two Anti-Repeat / Anti-Tie Down
    Finger Controlled Start Mechanisms
  • Built In Safety Light Curtains
  • Package position sensors prevent power pack from cycling if package is out of position
  • (4) Pneumatic Clamps Lock upper Package in Position